4 термално решење 5Г мобилног телефона
Heat dissipation has always been a difficult problem of great concern to the consumer electronics industry. With the advent of the intelligent era, the demand for mobile phones is increasing, the hardware configuration of mobile phones is also improving, and the performance of mobile phone processors is improving every year, which inevitably brings heating problems. More antennas need to be added to 5G mobile phones to receive signals. The high-speed network data transmission of colleagues also increases the heat of use and. Now the mainstream material used in mobile phones is glass. Compared with metal materials, its heat dissipation speed is significantly slower. In addition, the internal components of mobile phones are stacked more and more compact, which puts forward higher requirements for the heat dissipation capacity of multiple collections.
Thermal cooling technology has become one of the key points affecting the performance of mobile phones. Too high component temperature will affect the performance and reliability of electronic products. Heat conducting materials and devices are used to solve the problem of thermal management of electronic equipment. Mobile phone heat dissipation technologies include liquid cooling , graphene heat dissipation, vapor chamber and high thermal conductivity materials.
течно хлађење:
Mobile phone liquid cooling heat dissipation mainly uses heat pipe, which is essentially a hollow closed pipe containing liquid. In terms of management, the liquid has to evaporate and absorb heat, become gas, and become liquid exothermic in the condensation section of the pipeline. The advantage of liquid cooling heat dissipation lies in its service life and flexible setting. Liquid cooling heat dissipation can be placed in any position inside the mobile phone that needs heat dissipation.
Расипање топлоте графена:
Graphene heat dissipation is now the most common way of heat dissipation, which belongs to the heat dissipation form inside mobile phones, relying on the high thermal conductivity of graphene. Graphene material has high temperature resistance, good thermal conductivity and chemical stability. It is a cost-effective mobile phone thermal solution material at present. Its heat dissipation coefficient is 2 5 times that of copper material, but its density is only 1 / 10 1 / 4 of that of copper. At the same time, graphene is easy to process, can be customized according to needs, and has good plasticity.
Парна комора:
VC , also known as positive cavity soaking plate heat dissipation technology, is a vacuum cavity with fine structure on the inner wall, which is usually made of copper. When the heat causes the VC cavity by the heat source, the coolant in the cavity begins to gasify after heating, and the liquid vaporizes and absorbs heat. The condensed coolant will return to the evaporation heat source through the microstructure capillary pipe (the driving force of the whole cycle is capillary force). This process can be repeated continuously. The vapor chamber will have different designs according to the size of different components. The manufacturing process is relatively complex and the manufacturing cost is high. It is often used in flagship mobile phone products that need to control volume and need rapid heat dissipation.
Материјал високе топлотне проводљивости:
The thermal conductive interface material with high thermal conductivity is selected, which is mainly used to fill the micro gap and uneven hole on the surface when the two materials are joined or contacted, establish an effective heat conduction channel between the electronic components and the radiator, greatly reduce the heat transfer contact thermal resistance and improve the heat dissipation performance of the devices. For example, thermally conductive graphite sheet, thermally conductive silica gel sheet, and thermally conductive phase change materials.