Термички изазов ЛЕД-а

       Тренутно, главне технологије одвођења топлоте ЛЕД сијалица велике{0}}све снаге укључују хладњак, топлотну цев, парну комору, премаз за зрачење, термалну маст, заптивку за пренос топлоте итд.

      The heat sink uses the expanded surface area to dissipate heat convection to the environment. The factors affecting the heat dissipation performance of the heat sink include the shape of the heat sink, the number, spacing, size, inclination angle of the fin, the material and processing technology of the heat sink, which is also the most commonly used heat dissipation technology. The model lamps in this paper use the heat sink to dissipate heat.

    The heat pipe uses the cyclic change of condensate phase to export and dissipate the high heat emitted by LED. Generally, the cold end of the heat pipe is used together with the heat sink to achieve better heat dissipation effect.

 The principle of the vapor chamber is similar to that of the heat pipe, except that the heat pipe is one-dimensional and unidirectional heat transfer, while the temperature equalizing plate is surface heat transfer and has two-dimensional characteristics, so that the surface temperature of the whole radiator is uniform.

      Radiation coating is to apply heat dissipation coating on the outer surface of the radiator to improve the emissivity and make the heat radiate more effectively. The purpose of heat conductive paste and heat conductive gasket is to reduce the contact thermal resistance.

Термички изазов ЛЕД:

1. If the arrangement of heat dissipation fins does not take into account the use mode of lamps, it affects the heat dissipation effect of heat dissipation fins. Heat dissipation fins in line with the characteristics of products should be designed.

2. LED thermal design overemphasizes the heat conduction link, but ignores the convection heat dissipation link. Heat pipe, heat conductive silicone grease and other heat dissipation measures reduce the thermal resistance through heat conduction, but the heat ultimately depends on the surface area of the lamp, so coating radiation coating on the outer surface is a development trend.

3. LED device ignores the balance of heat transfer. If the temperature distribution of the fins is seriously uneven, some of the fins will not play a role or have a limited role. The vapor chamber can balance the temperature.

4. The best way to cool the lamps is to find the shortest heat dissipation channel to release the heat into the atmosphere as soon as possible. Among them, the interfacial thermal resistance is the bottleneck of the heat dissipation channel, so the focus of heat dissipation should also be on the interfacial heat conduction material.