Термичко пројектовање полупроводничких компоненти у електронској опреми
What is thermal design?
In the design of electronic equipment, it has always been necessary to solve the problems of miniaturization, high efficiency, EMC (electromagnetic compatibility), etc. In recent years, the thermal countermeasures of semiconductor components have been paid more and more attention, and the thermal design of semiconductor components has become a new Subject. Since "hot" involves the performance, reliability and safety of components and equipment, it has always been one of the important research projects. In recent years, the requirements for electronic equipment have changed, so it is necessary to re-examine the past methods.
In "Thermal Design of Semiconductor Components in Electronic Equipment", in principle, we will discuss topics related to thermal design on the premise of semiconductor products such as ICs and transistors used in electronic equipment.
Semiconductor components specify the chip temperature inside the package, that is, the absolute maximum rating Tjmax of the junction (joint) temperature. When designing, it is necessary to conduct research on heat generation and ambient temperature to ensure that the junction temperature of the product does not exceed Tjmax. Therefore, thermal calculations will be performed on all semiconductor components to be used to confirm whether Tjmax is exceeded. If it is possible to exceed Tjmax, take measures to reduce loss or heat dissipation to keep Tjmax within the maximum rated value range. In short, this is thermal design.
Of course, not only semiconductor products are used in electronic equipment, but also various components such as capacitors, resistors, and motors, and each component has absolute maximum ratings related to temperature and power consumption. Therefore, in actual design, the composition All parts of the equipment must not exceed the maximum temperature-related ratings.
The need for good thermal design in the design phase
If the thermal design is not carefully carried out in the design stage and corresponding measures are taken, problems caused by heat may be discovered in the trial production stage or even when the product is put into mass production.
Although the problem is not limited to heat, the closer to the mass production stage, the more time it takes to take countermeasures, the higher the cost, and even delays in product delivery, leading to the big problem of missing business opportunities. The worst-case scenario is that the problem only occurs in the market, leading to recalls and credit problems. Although we are unwilling to imagine the problems caused by heat, improper heat treatment is very likely to cause smoke, fire, and even fires and other personal safety issues. Therefore, thermal design is fundamentally very important. Therefore, it is necessary to do a good job of thermal design from the beginning.
Thermal design is becoming more and more important
In recent years, for electronic devices, the requirements for miniaturization and high performance have become natural, and thus further integration has been promoted. Specifically speaking, the number of components is larger, the mounting density on the circuit board is higher, and the housing size is smaller. The result is a significant increase in heat generation density.
The first thing to realize is that with the changes in technological development trends, thermal design has become more stringent than ever. As mentioned above, equipment not only requires increasingly "miniaturization" and "high performance" of components, but also requires excellent "design flexibility", so thermal countermeasures (heat dissipation measures) have become a big issue. As thermal design helps improve equipment reliability, safety, and reduce overall costs, it is becoming more and more important.
