Notebook Cooling Zipper Fin Heatsink Demand From Singapore Customer

      Last month , we sent 10pcs notebook cpu heatsink samples to the Singapore customer, and we received the feedback from the customer site that the heatsink can meet their system requirement, and they want to but 200pcs order this time for mass production. Thanks for the choosing of Sinda Thermal ,we will start the raw material preparation as soon as possible.

   Thinness has become the trend of notebook development. From the perspective of heat dissipation, thinness means that the space is further compressed. How to quickly dissipate the internal heat in a narrow space is very important to the performance of notebook computers. The heat pipe + fan design is the most common thermal design of notebook computers at present. Its biggest advantage is that the heat of the core components can be quickly transferred to the heat sink through the heat pipe, and then the heat can be forcibly discharged through the fan. 

laptop cpu heatsink

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