6 cooling methods of electronic devices
With the rapid development of the high -frequency, high -speed and integrated circuit technology of electronic devices, the total power density of electronic components has increased significantly, and the physical size is getting smaller and smaller, and the heat flow density increases. Therefore It affects the performance of electronic components, which requires more efficient thermal control to it. How to solve the heat dissipation problem of electronic components is the focus of the present stage. Therefore, this article briefly analyzes the heat dissipation method of electronic components.
The efficient heat dissipation of electronic components is affected by the principle of heat transfer and fluid mechanics. The heat dissipation of electrical devices is to control the operating temperature of the electronic equipment to ensure the temperature and safety of its work. It mainly involves different contents of heat dissipation and materials. At this stage, the main heat dissipation methods are mainly natural convection, air forced convection, liquid cooling, refrigeration, dredging, heat pipe and other methods.
1. Natural convection
The natural heat dissipation or cooling method is in the natural situation, and the effects of any external auxiliary energy are not accepted. Through local heat, it controls the temperature control by the surrounding environment. The main application is several ways to stream and natural convection. Among them, natural heat dissipation and cooling methods are mainly applied to low -power equipment and components with relatively low heat flow density with low temperature control requirements and components with lower temperature control requirements. This method can also be applied in the state of sealing and densely assembled devices that do not need to be applied in other cooling technologies. In some cases, when the heat dissipation capacity requirements are relatively low, the characteristics of the electronic devices will also be used to appropriately increase its influence of heat -sinking heat conducting or radiation nearby. ability.
2, Air forced convection
Music cooling or cooling method is a way to speed up the air flow around electronic components through fan and other methods to take away calories. This method is simple and convenient, and the application effect is significant. In the electronic component, if the space is large, the air flows or some heat dissipation facilities are installed, this method can be applied. In practice, the main method of improving this kind of heat spreading ability is as follows: It is necessary to appropriately increase the total area of heat dissipation, and to produce a relatively large heat circulation coefficient on the surface of the heat dissipation.
In practice, the method of increasing the surface heat dissipation area of the radiator is widely used. In the engineering, the surface area of the radiator is expanded through the method of the wing tablet, and then the heat transfer effect is strengthened. The wing tablet can be divided into different forms, the surface of some thermal electronic devices and the heat exchanging devices applied in the air. Applying this mode can reduce thermal sinking and heat resistance, and can also improve its heat dissipation effect. As for some electronics with relatively large power, the spoiler method in the air can be used for processing. By adding a sphere of sphere to the radiator, the introduction of spoiler in the surface flow field of the radiator can increase heat exchange heat exchange. Effect.
3, liquid cooling
The method of using liquid cooling in electronic components for cooling is a cooling method based on chip and chip components. Liquid cooling can be divided into two ways: direct cooling and indirect cooling. The indirect liquid cooling method is to contact the electronic component directly with the liquid coolant that it is used. Through the intermediate medium system, the auxiliary device such as liquid modules, heat conduction modules, jet liquid modules, and liquid substrates is used in the launching thermal components. Pass. Direct liquid cooling method can also be called immersion cooling method, that is, direct contact with related electronic components, absorb calories and take away the heat through the cooler, mainly because some thermal consumption volume density is relatively high or in high temperature environments in high temperature environments. Application device.
4, refrigeration
The cooling methods of cooling or cooling methods mainly include the cooling and cooling of refrigerant and PCLTier refrigeration. The methods adopted in different environments are also different. It is necessary to comprehensively apply the actual situation. The phase change of refrigerant is a way to absorb a lot of calories through the phase change of the refrigerant, which can cool the electronic device on some specific occasions. The general state is mainly the heat in the environment through refrigerant evaporation, which mainly includes two types: volume boiling and flow boiling. Under general conditions, deep cold technology also has important value and influence in the cooling of electronic components. In some computer systems with relatively large power, deep -cold technology can be used, which can not only improve the circulation efficiency, but also the number of refrigeration and temperature range is relatively wide. Higher. Pcltier refrigeration is used to heat dissipation or cool down through semiconductor refrigeration. It has the advantages of small installations, convenient installation and strong quality, and easy to disassemble. This method is also called a thermal power refrigeration method. It is through the PCLTier effect of the semiconductor material itself. The electric puppet can be formed under the action of the series through different semiconductor materials. In this way, the effect of refrigeration can be achieved. This method is a refrigeration technology and means to generate negative thermal resistance. Its stability is relatively high, but because of its relatively high cost, relatively low efficiency, in some relatively compact volume, and low requirements for refrigeration, and low requirements for refrigeration are low, low requirements for refrigeration are low. Application in the environment. Its heat dissipation temperature ≤100 ° C; cooling load ≤ 300W.
5, dredging
It is to pass the heat from the heat transfer element that transmits heat to the heat transfer element to another environment. In the process of the integration of electronic circuits, high -power electronic devices gradually increased, and the size of the electronic devices became smaller and smaller. In this regard, this requires that the heat dissipation device itself must have certain heat dissipation conditions, and the heat dissipation device itself must also have certain heat dissipation conditions. Because the thermal pipe technology has certain thermal conductivity and good temperature characteristics, it has the advantages of heat flow density degeneration and good thermal temperature characteristics in the application. It can quickly adapt to the environment. It can effectively meet the flexible, high efficiency and reliability characteristics of the heat dissipation device. At this stage, it is widely used in electrical equipment, electronic component cooling, and the heat dissipation of semiconductor components. The heat pipe is a mode of high efficiency and the heat transmission method of heat transfer. It is widely used in electronic component heat dissipation. In practice, different types of types of types must be designed separately, analyzing the impact of factors such as gravity and external forces on different types of requirements. In the process of designing the heat pipe design, the materials, processes, and cleanliness of the production should be analyzed, and the quality of the product should be strictly controlled and the temperature monitoring and treatment should be performed.
6, heat pipe
The typical heat pipe consists of tube shell, porous hair core and working medium. After absorbing the heat vaporization generated by the heat source from the evaporation section under the vacuum state, the working quality quickly flows to the condensate section under the action of small pressure differences, and releases the heat to the cold source to condense into liquid condensate and then sucks in the absorbent core hair. Back the evaporation section from the condensation section under the action of force, and then absorb the heat generated by the heat source. In this way, the heat is continuously transmitted from the evaporation section to the condensed section. The biggest advantage of the heat pipe is that it can pass a large amount of heat when the temperature difference is small. The relative thermal conductivity is a few hundred times the copper is called "near superconducting thermal", but any heat tube has the limit of heat transfer. When When the heat capacity of the steaming end exceeds the limit value, the working medium in the heat pipe will all vaporize, resulting in the failure of the heat pipe in the circulation process.
